RTS: 3D-IC technology trend and and current development status for stacked pixel detectors
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Sunrise (WH11NE) (Fermilab)
Sunrise (WH11NE)
Fermilab
Description
Recent 3D-IC technology and market trends are introduced. Also, current development status, design rules, 3D structures, yield issues and the cost reduction methods for stacked pixel detectors are presented. Tohoku-MicroTec (T-Micro) is the unique and advanced 3D/2.5D IC process and MEMS process-oriented company, originated in the Tohoku University. As an exclusive technical representative of the GINTI "Global Integration Initiative" facility, T-Micro provides worldwide customers with 3D/ 2.5D/ MEMS full foundry service as well as partial process service by use of a complete line of state-of-the-art 200 and 300 mm equipment in a cost-effective and short-TAT way for R/D, prototype, and small volume production. Dr. Motoyoshi is the semiconductor expert with more than 25 years of experiences at technology and business in memory device and 3D Stacking LSI. He is former President & CEO of ZyCube, Inc., the leading 3D Stacking LSI for CMOS image sensor in Japan. He has presented seminars, lectures and invited presentations at domestic and international societies associated with 3D Stacking LSI over 40 times.
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3D-IC technology trend and current development status for stacked pixel detectors1h