Introduction - CPAD 2024 Summary

• Mitch Newcomer (U.Penn)

Work Package Development for Novel Interconnect

• Mathieu Benoit (ORNL)
• Ron Lipton (FNAL)

Ron Lipton has offered to kick off the topic with a brief summary of current options for fine pitch interconnects between pixel sensor array and readout electronics & to give some examples of previous and current developments in the HEP community. Open Discussion on the Current Status of Pixel to Sensor Interconnect and what might qualify as interesting and useful for a dedicated interconnect development initiative. Starter Topics: Difficulty (number of steps / internal / external operations) Yield Smallest Reliable contact Spacing Interconnect medium / contacting technique Ageing Environmental Restrictions

Topics for Future Meetings & Plan for next meeting time. RDC4 – Service packages? An interesting/useful topic discussed at CPAD as part of DRD7's planning. Joint Meetings RDC 9 Calorimetry RDC 2 Photonics RDC 3 Readout Electronics for Solid State Trackers RDC 5 Triggering etc…