Speaker
Dr
Makoto Motoyoshi
(President ZyCube Corporation Ltd.)
Summary
Recently the development of three-dimensional large-scale integration (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a view to mass production. The 3D-LSI using Through-Silicon Via (TSV) has simplest structure and it is expected to realize high-performance, high-functionality and high density LSI cube. This presentation covers the current 3D technology for chip size package of image sensor devices and next generation 3D-LSI technologies.