Pixel 2008 International Workshop

Name: Pixel 2008 International Workshop
Start: 2008-09-23T07:30:00-05:00
End: 2008-09-26T16:30:00-05:00
Location: Fermilab, Batavia, IL

23–26 Sep 2008

Fermilab, Batavia, IL

US/Central timezone

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Session

3D Bonding

25 Sep 2008, 10:50

Fermilab, Batavia, IL

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78. Test Results from the VIP Chip

Grzegorz Deptuch (Fermilab)

25/09/2008, 10:50

79. Fabrication, Assembly, and Evaluation of Cu-Sn and Cu-Cu Bump Bonding arrays for Ultra-Fine Pitch Hybridization and 3D Integration

Alan Huffman (RTI)

25/09/2008, 11:15

80. Status and perspectives of Deep N-Well 130 nm CMOS MAPS

Prof. Valerio Re (Università di Bergamo)

25/09/2008, 11:40

81. Analysis of 3D Stacked, Fully Functional CMOS Active Pixel Sensor Detectors

Dr Daniele Passeri (University of Perugia, Italy)

25/09/2008, 12:05

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Pixel 2008 International Workshop

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